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IEEE/ICACT20230043 Slide.03        [Big Slide]	Oral Presentation
	High bandwidth memory is a CPU/GPU memory chip,which is many DDR chips stacked together by 3D die-stacking and TSV technology,and packaged together with GPU to achieve a large-capacity, highwidth DDR composite array. The HBM stack is not physically integrated with the CPU or GPU, but is tightly and quickly connected through the intermediary layer. The HBM has almost the same characteristics as the chip integrated RAM, therefore, has higher speed and bandwidth. HBM is package-level memory based on a wide input/output parallel interface.

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