Virual Oral Presentation Slide by Slide

IEEE/ICACT20250085 Slide.06        [Big Slide]	Oral Presentation
	Preparing InPut, Out buffer models and simulation tools In order to perform a signal integrity analysis PCB files (ODB++ or BRD), schematics IBIS models for IC chips package loss models for cables or connectors PCB stack-up information, etc., must be prepared in advance. Setting up the specifications Selecting Nets for Simulation and Creating S-parameter Models Insertion Loss and Input Reflection Coefficients Eye Diagram Analysis Results According to Schematic Composition Changes

[Go to Next Slide]

Select Voice: Virtual Oral Presentation!!