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IEEE/ICACT20220159 Slide.10        [Big Slide]	Oral Presentation
	To make the OPA chip in to a module, optical packaging is needed. We have mainly used epoxy bonding for packaging fiber block array to OPA chip. This is the conventional packaging method for optical packaing, but has very low manufacturing yield. And also has a very bulky size not suitable for optical components. We have developed a new technology called direct optical wire bonding with Lessengers Inc. for optical packaging.

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