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for that, passive optical packaging without additional structural components have been developed.
It uses polymer waveguides to link the gap between chips.
The concept is the link the gap just like metal wiring.
The very first research on this concept was done by the KIT group. also known as photonic wire bond.
It uses two-photon lithography with negative-tone resist for fabricating the wire.
But, we developed the equal concept technology without using the lithography. and can be fabricated in open-air
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IEEE/ICACT20220159 Slide.12
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