Virual Oral Presentation Slide by Slide

IEEE/ICACT20220159 Slide.17        [Big Slide]	Oral Presentation
	And for the fabrication, we have fabricated with two different chip distances of 300um and 100um the experiment results were very similar with the simulation results, proving that the wire is well made comparing to the fiber link, the DOW link has lower coupling loss and larger bandwidth.

[Go to Next Slide]

Select Voice: Virtual Oral Presentation!!