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IEEE/ICACT20220159 Slide.18        [Big Slide]	Oral Presentation
	And for further research, we will apply this DOW technology for fiber-to-chip and hybrid integration of lasers. First, we have researched on fiber-to-chip coupling. It had lower results than the simulation, since the out-of-plane DOW bonding needs additional technique for rotating the micropipette. In our current fabrication set-up the rotation of the micropipette is a little unstable. but we are modifying the set-up and equipments..so in the near feature, the performance will be highly improved.

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