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In this paper, CAE using skip connection is proposed for semiconductor wafer map defect classification.
The proposed model was able to secure high-quality data with a small loss value by adjusting the depth of the model due to skip connection.
In addition, the accuracy of wafer defect classification could be improved by reusing the learned encoder to encode the input data of the classifier.
This study used the open data set WM-811K, but if real field data with noise are available, models of various depths can be compared.
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IEEE/ICACT20220181 Slide.20
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